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TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging

  • Written by The Bulletin

— Industry’s First Double-Sided and Internal Defect Inspection —

YOKOHAMA, JAPAN - Media OutReach Newswire - 27 February 2025 - TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.

Read more: TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging

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